Advanced Packaging Technologies used in NASA ’ s 3 D Space Flight Computer

During 1995-1997, NASA’s New Millennium Program developed the 3 0 Flight Computer technology for validation on its j r s t Deep-Space I mission launched in October 1998. Whereas, the computer was not delivered on schedule for inclusion on the spacecraft, it was delivered, integrated and space qualified at JPL. This computer is characterized by the aggressive use of advanced packaging technologies: 3 0 chip stacking, multichip modules, and 3 0 MCM stacking. This development represents an important technology milestone towards the further miniaturization of all spacecraft avionics into an integrated architecture.